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Use of Spherical Silica Powder

wallpapers Industry 2020-11-05
Spherical silicon powder is mainly used for large-scale integrated circuit packaging and has applications in high-tech fields such as aviation, aerospace, fine chemicals, rewritable discs, and large-area electronic substrates, unique ceramics, and daily cosmetics, and has a broad market prospect. Experts predict that by 2010, my country's demand for spherical silica powder alone will reach 20,000 to 30,000 tons, and high-purity silica powder will be 100,000 tons, with an average annual growth rate of more than 20%. The world's demand for spherical silica powder will exceed 300,000 tons, worth tens of billions.
 
With the rapid development of my country's microelectronics industry, large-scale and ultra-large-scale integrated circuits have higher and higher requirements for packaging materials, requiring ultra-fine and high purity, especially for particle shapes. However, spherical silica powder is an interdisciplinary and challenging project. Only a few countries worldwide, such as the United States, Japan, Germany, Canada, and Russia, have mastered this technology. As we all know, the spherical silica purchased domestically mainly comes from Japan and South Korea. Imported spherical silica is expensive and has a long transportation cycle. The domestically produced high-quality spherical silica has local advantages and can completely replace imports.
 
The primary purpose and performance of spherical powder
Why spheroid? First of all, the ball's surface has good fluidity, which is uniformly mixed with the resin to form a film. The amount of resin added is small, and the fluidity is the best. The powder's billing amount can reach the highest, and the weight ratio can get 90.5%. Therefore, spheroidization means silicon powder. With the increase of the filling rate, the higher the filling rate of silicon micro powder, the smaller the thermal expansion coefficient, the lower the thermal conductivity, and the closer to the monocrystalline silicon's thermal expansion coefficient, the better the performance of electronic components produced from that place.
 
Secondly, the spheroidized plastic molding compound has the least stress concentration and the highest strength. When the stress concentration of the angular powder molding compound is 1, the spherical powder's stress is only 0.6. Therefore, when the spherical powder molding compound encapsulates the integrated circuit chip, the yield rate High, and it is not easy to produce mechanical damage during transportation, installation, and use. Third, the spherical powder has a small friction coefficient and less wear on the mold, making the mold have a long service life. Compared with the angular powder, the service life of the mold can be doubled. The plastic compound's packaging mold is costly, and some Imports are also needed, which is also essential for packaging factories to reduce costs and improve economic efficiency.


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Tag: Silica Powder